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CHIP 2014 - Beijing International Packaging Fair 2014


CHIP 2014

Beijing International Packaging Fair 2014

Announcement: CHIPF 2014 will be postponed. We will notice you of detailed hosting time later. 

CHIP 2014 - Beijing International Packaging Fair 2014, as one of the largest comprehensive packaging exhibitions in Asia, will be held from June 30 to July 2, 2014 at New China International Exhibition Centre(NCIEC), Beijing.

At present, due to fast growth and stable development of China's economy, packaging has become widely applied to printing, food, beverage, dairy, pharmaceutical, daily chemical, electronics, logistics and other industries, and it’s closely related to people's lives. As the only packaging exhibition majorly supported by the Ministry of Commerce of the People’s Republic of ChinaBeijing International Packaging Fair 2014 (CHIPF 2014) will be again presented on a lager scale, a strong international lineup and more professional buyers.

CHIPF 2014 will take “packaging changes life” as the theme, “achieve sustainable development of packaging industry” as the goal as well as all-round displays the latest technologies, products and solutions in various packaging fields at home and abroad, setting up an efficient interactive platform for supply and demand sides. It’s anticipated to have 400 exhibitors and over 40,000 professional visitors attending the exhibition.

In addition, CHIPF 2014 will pay much attention to organizing professional visitors, cooperates with the Embassies, offices in more than 20 countries and regions worldwide and industry chambers/associations to organize members to visit the international trade show.


Exhibitor's Profile:
Exhibits scope:

○   Packaging machinery, materials and processing machinery;
○ Processing and packaging machinery of pharmaceuticals and daily chemical products;
○ Corrugated and color box processing machinery and materials;
○ Coding, label, anti-counterfeit technology, labeling;
○ Detection equipment and control systems, eco-friendly materials, equipment and technology, packaging design, related packaging industry groups and the institutes of Technology;
○ Auxiliary packaging machinery;
○ Various packaging containers and products;
○ Food beverage processing and packaging machinery;
○ Printing machinery, suppliers and ancillary equipment;
○ Inks and coating materials;
○ Other related products and services.


Name: Beijing Sunsource Expo Co., Ltd.
Address: The 10th Floor, China Garments Mansion, No. 99 Jianguo Road, Chaoyang District, Beijing.
Tel: +86-10-5102 6890/91/92—105/106/108; +86-10-5102 6893
Fax: +86-10-5102 6890 -111; +86-10-5102 6893

Beijing Sunsource Expo Co., Ltd.  

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